Conductive adhesive - List of Manufacturers, Suppliers, Companies and Products

Conductive adhesive Product List

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Conductive adhesive (silver paste) TK PASTE series

Conductive adhesive (silver paste) TK PASTE series

Our company is developing unique silver pastes (conductive adhesives) by continuously creating various special shapes of "TK silver powder" using our proprietary technology.

TK PASTE is a silver paste/conductive adhesive with the following features: 1. Uses TK silver powder with controllable silver shape and particle size. 2. Achieves various functions such as low resistance, low silver content, and high reliability. 3. Exhibits good continuous dispensing performance with a dispenser.

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RF-ID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Anisotropic conductive adhesive "Smurf"

Anisotropic conductive adhesive "Smurf"

Curing is possible in as little as 1 to 2 seconds! We have achieved high reliability by using our metal coating powder.

"Smurf" is a one-component heat-curing epoxy adhesive for RFID inlays. By using our metal-coated powder, high reliability is achieved. Curing can be completed in as little as 1 to 2 seconds. Additionally, viscosity can be adjusted depending on the application method, such as jetting or dispensing. Furthermore, by employing special conductive particles, high reliability is maintained even in high-temperature and high-humidity tests, as well as thermal cycling tests. 【Features】 ■ For RFID inlays ■ One-component heat-curing ■ Viscosity can be adjusted based on application methods such as jetting and dispensing ■ One-component thermosetting epoxy adhesive with no volatile components, making it easy to handle ■ Excellent adhesion to various materials such as Al, Cu, Ag, PET, and PI *For more details, please refer to the PDF document or feel free to contact us.

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